Thin Films Module Development Engineer

Intel is hiring a Thin Films Module Development Engineer. It pays $156k-$255k a year and Level rates it ; you can apply on Intel.

Level's read on this job

Little AI ●○○○ is how Level rates this role: aI is not part of the work.
Tools and skills the posting cites include Doe, Spc and thin films.
Level classifies it as a senior role.
Level lists 842 other open roles at Intel.
The role was posted within the past two weeks.

AI in this role

Develops and optimizes thin-film metal modules for advanced semiconductor manufacturing processes.

DoeSpc

thin-filmsprocess-engineeringsemiconductor-manufacturingdefect-reduction

Job Details:

Job Description:

Intel Foundry is seeking experienced Thin Films Metals Module Development Engineers to join the Technology Development organization. The role will be defined by developing and delivering metals modules for advanced semiconductor technologies, leveraging a combination of in-depth hardware knowledge and process expertise to deliver modules that fulfill program process needs within the hardware capabilities.

This is a hands-on technical role for results-oriented engineers who can formulate concise technical problem statements, establish a roadmap and timeline, lead with data and partner with stakeholders to deliver on-time results.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

Bachelor's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 6+ years of experience

Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 4+ years of experience

Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 2+ years of experience

Experience in semiconductor manufacturing or process development includes one or more of the following:

Expertise in process optimization, defect reduction, and manufacturing process improvements for advanced technology nodes
Proficiency in Design of Experiments (DOE), Statistical Process Control (SPC), and structured problem-solving methodologies
Hands-on expertise in dry etch processes, material science, and equipment metrology
Technical experience with semiconductor manufacturing equipment and collaboration with suppliers to optimize hardware and materials

Preferred Qualifications:

Doctoral degree in a relevant engineering or science field
Experience with sub-10nm technology nodes and advanced device architectures like FinFET or Gate-All-Around (GAA)
Proven record of delivering process solutions in Technology Development (TD) and High Volume Manufacturing (HVM)
Cross-functional leadership experience for yield improvement, defect reduction, or technology ramp initiatives
Experience mentoring engineers and providing technical guidance
Strong ownership mindset with the ability to lead initiatives from concept through implementation

For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $155,520.00-255,200.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

How we rate this

Thin Films Module Development Engineer at Intel rates 0 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.

Key facts

Thin Films Module Development Engineer is an open job at Intel.
Level rates this role AI Level 1 of 4: Little AI.
The listed salary is $156k-$255k a year.
The role is based in US, Oregon, Hillsboro.
The job was posted on October 30, 2026.
Seniority: senior.
Applications are handled by Intel. Apply on Intel

Prepare for this job

Built from this posting and from similar jobs on Level.

Skills and AI tools this role asks for

Thin FilmsProcess EngineeringSemiconductor ManufacturingDefect ReductionDoeSpc

Questions you could be asked

Tell me about a project where thin films was part of your work. What did you do?
Tell me about a project where process engineering was part of your work. What did you do?
Tell me about a project where semiconductor manufacturing was part of your work. What did you do?
Tell me about a project where defect reduction was part of your work. What did you do?
Walk me through how you've used Doe in your day-to-day work.

Adapt your resume

List these exact terms on your resume: Thin Films, Process Engineering, Semiconductor Manufacturing, Defect Reduction, and Doe. An applicant tracking system matches the wording, not the idea.
Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.

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