Advanced Packaging Development Engineer

Intel is hiring an Advanced Packaging Development Engineer in Phoenix, United States. It pays $134k-$189k a year and Level rates it ; you can apply on Intel.

Level's read on this job

Level rates this role Little AI ●○○○: aI is not part of the work.
The posting mentions Spc, Doe and semiconductor packaging among its tools and skills.
Level classes it as a mid-level role.
Intel has 823 other open roles on Level.
Posted within the past two weeks.

AI in this role

Drive design and optimization of innovative packaging processes and equipment for next-generation semiconductor technologies.

spcdoe

semiconductor-packagingprocess-engineeringmanufacturing-optimizationdata-analysis

Job Details:

Job Description:

The Role and Impact
As a Packaging Module Development Engineer, you will drive the design and optimization of innovative packaging processes and equipment essential to Intel's next-generation semiconductor technologies. Your day-to-day responsibilities will include developing solutions to enhance reliability, manufacturability, and performance in high-volume manufacturing environments. These contributions will play a critical role in advancing Intel's leadership in semiconductor packaging technologies.

Business Group
This role is part of Intel Corporation's Advanced Packaging Technology Manufacturing (APTM) organization, which focuses on developing and scaling cutting-edge semiconductor packaging solutions. APTM supports Intel's broader mission by delivering technologies that empower high-performance, edge, and mobile computing applications, enabling global customer success and technological leadership.

Key Responsibilities

Develop, optimize, and qualify packaging assembly processes, materials, and equipment to meet quality, reliability, yield, and cost targets.

Drive experimental design using methodologies such as Statistical Process Control (SPC) and Design of Experiments (DOE).

Innovate new techniques, materials, and tools to address emerging challenges in packaging reliability and manufacturability.

Collaborate with cross-functional teams to mitigate technical risks and ensure product development success.

Establish process specifications and material requirements while working with suppliers to meet stringent quality standards.

Document technical findings, process improvements, and advancements through detailed reports and technical papers.

Provide support for equipment performance and process health in both development and high-volume manufacturing environments.

Core Competencies

Strong communication skills to collaborate across diverse teams and stakeholders.

Strong analytical skills, including data analysis and risk assessment to inform decision-making.

Qualifications:

The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

Bachelor's degree in Engineering, Physics, Chemistry, or a related STEM field with 3+ years of industry experience. -OR-

Master's degree in Engineering, Physics, Chemistry, or a related STEM field with 2+ years of industry experience. -OR-

PhD in Engineering, Physics, Chemistry, or a related STEM field with no prior professional experience.

Experience with process development and/or equipment qualification for manufacturing applications.

Preferred Qualifications

Experience leading technical teams and collaborating across matrixed organizations to drive innovation.

Experience in Statistical Process Control (SPC), Design of Experiments (DOE), and process characterization techniques

Experience with semiconductor fabrication processes, packaging flows, and assembly methodologies.

Proven ability to deliver results in time-sensitive technical projects with a focus on process improvement. Knowledge of quality systems, documentation standards, and tools for packaging reliability evaluation.

Proficiency in programming languages such as Python, MATLAB, or SQL to analyze complex datasets.

Join Intel's world-class technology development team and use your expertise to push the boundaries of innovation in semiconductor packaging. Take the next step in your career and apply today to help shape the future of technology.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

How we rate this

Advanced Packaging Development Engineer at Intel rates 0 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.

Key facts

Advanced Packaging Development Engineer is an open job at Intel.
Level rates this role AI Level 1 of 4: Little AI.
The listed salary is $134k-$189k a year.
The role is based in US, Arizona, Phoenix.
The job was posted on October 26, 2026.
Seniority: mid.
Applications are handled by Intel. Apply on Intel

Prepare for this job

Built from this posting and from similar jobs on Level.

Skills and AI tools this role asks for

Semiconductor PackagingProcess EngineeringManufacturing OptimizationData AnalysisSpcDoe

Questions you could be asked

Tell me about a project where semiconductor packaging was part of your work. What did you do?
Tell me about a project where process engineering was part of your work. What did you do?
Tell me about a project where manufacturing optimization was part of your work. What did you do?
Tell me about a project where data analysis was part of your work. What did you do?
Walk me through how you've used Spc in your day-to-day work.

Adapt your resume

List these exact terms on your resume: Semiconductor Packaging, Process Engineering, Manufacturing Optimization, Data Analysis, and Spc. An applicant tracking system matches the wording, not the idea.
Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.

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