ATD Laser Development Engineer
Intel is hiring an ATD Laser Development Engineer in Phoenix, United States. It pays $85k-$163k a year and Level rates it ; you can apply on Intel.
Level's read on this job
- Little AI ●○○○ is how Level rates this role: aI is not part of the work.
- Tools and skills the posting cites include Design Of Experiments, laser assembly and semiconductor packaging.
- Level classifies it as a mid-level role.
- Level lists 860 other open roles at Intel.
AI in this role
Design and develop laser assembly packaging processes and equipment for next-generation semiconductor technologies.
Job Description:
The Role and Impact
Join Intel as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping the future of semiconductor packaging technologies. This position offers a unique opportunity to contribute to the development of cutting-edge processes and equipment that enable Intel to stay at the forefront of innovation. Your work will directly impact the performance, quality, and reliability of Intel's assembly and packaging solutions, driving advancements in technology that address the dynamic needs of the semiconductor industry. Through technical expertise and collaboration with cross-functional teams, you will help Intel achieve its mission of delivering world-class packaging solutions.
Key Responsibilities
- Design and develop laser assembly packaging processes and equipment to enable next-generation packaging technologies.
- Optimize manufacturing processes to meet stringent quality, reliability, cost, yield, productivity, and manufacturability requirements.
- Develop process and equipment specifications using Design of Experiments (DOE) and data analysis principles.
- Oversee the manufacturability of physical layout designs and manage the full cycle of packaging processes, procedures, and flows.
- Establish laser process specifications and collaborate with suppliers to meet quality and performance standards.
- Innovate new techniques, tools, and quality screens for early identification of potential packaging quality and reliability issues.
- Set laser process reliability requirements based on a strong understanding of failure mechanisms, influencing design, material selection, and process development.
- Drive standardization in qualification procedures, manufacturing quality systems, and processes while collaborating with engineering teams to meet critical milestones.
Qualifications:
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications
Bachelor's degree in Physics, Mechanical Engineering, Optical Engineering or related STEM field
OR Master's degree in Physics, Mechanical Engineering, Optical Engineering or related STEM field
Relevant experience should include the following:
- Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
- Fundamental understanding of laser and optical systems
Preferred Qualifications
- Hands-on experience in a technology manufacturing environment or semiconductor packaging processes and troubleshooting laser based equipment/systems.
- Familiarity with equipment adjustment, process characterization, and manufacturability in semiconductor or electronics assembly.
- Demonstrated ability to collaborate with cross-functional teams and deliver results in time-sensitive projects.
- Capability to apply Data Science and Statistics tools (Python, Numpy/Pandas, SQL, JMP, Minitab) to manipulate large complex data sets.
We invite you to bring your expertise, creativity, and passion for technology innovation to Intel. Join us in driving the future of semiconductor packaging and make a lasting impact on the technology landscape. Apply today.
Job Type:
College GradShift:
Shift 1 (United States of America)Primary Location:
US, Arizona, PhoenixAdditional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $85,200.00-162,500.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.How we rate this
ATD Laser Development Engineer at Intel rates 0 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.
Little AI. AI is not part of the work.
- ●●●● Builds AI80 to 100
- ●●●○ Works on AI60 to 79
- ●●○○ Uses AI40 to 59
- ●○○○ Little AI0 to 39
Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.
Prepare for this job
Built from this posting and from similar jobs on Level.
Skills and AI tools this role asks for
Questions you could be asked
- Tell me about a project where laser assembly was part of your work. What did you do?
- Tell me about a project where semiconductor packaging was part of your work. What did you do?
- Tell me about a project where process optimization was part of your work. What did you do?
- Tell me about a project where failure analysis was part of your work. What did you do?
- Walk me through how you've used Design Of Experiments in your day-to-day work.
Adapt your resume
- List these exact terms on your resume: Laser Assembly, Semiconductor Packaging, Process Optimization, Failure Analysis, and Design Of Experiments. An applicant tracking system matches the wording, not the idea.
- Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.
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