EMIB-T Substrate Yield Lead

Intel is hiring an EMIB-T Substrate Yield Lead in Phoenix, United States. It pays $181k-$255k a year and Level rates it ; you can apply on Intel.

Level's read on this job

On Level's scale, this role is Works on AI ●●●○: the daily work is on AI products, without building the model.
The posting mentions Dashboards, Automated Analytics and computer vision among its tools and skills.
Level classes it as a lead role.
Intel has 826 other open roles on Level.

AI in this role

Lead advanced packaging substrate yield performance and scale AI/ML defect detection infrastructure.

dashboardsautomated-analytics

computer-visionyield-managementadvanced-packagingdefect-reductioncross-functional-leadershipmachine-learning

Job Details:

Job Description:

Intel's APTM organization is seeking a highly driven and execution-focused EMIB-T Substrate Yield Lead to lead yield performance for next-generation advanced packaging technologies, including EMIB-T (Embedded Multi-die Interconnect Bridge with TSV), Intel's most advanced platform for heterogeneous integration. This is a high-visibility, high-accountability role with significant responsibility for enabling successful technology development and manufacturing readiness across both Intel Foundry Services (IFS) and Intel Product Groups (IPG).

The ideal candidate is a self-starter who thrives in ambiguous and fast-paced environments, proactively drives issues to closure, and requires minimal supervision. Success in this role requires strong technical depth, urgency in execution, the ability to influence cross-functional teams and suppliers, and a relentless focus on delivering yield and program milestones.

Key Responsibilities

Own end-to-end substrate yield performance for EMIB-T technology development and manufacturing readiness.
Drive DFM/DFY engagement, defect pareto closure, process optimization, and yield improvement plans from signal identification through execution.
Lead daily yield huddles and cross-functional reviews to ensure program execution remains on track and yield risks are identified and addressed with urgency.
Proactively identify, prioritize, and drive closure of critical yield, reliability, process, and supplier-related issues with minimal management oversight.
Partner closely with substrate suppliers, substrate module engineers, substrate integration, manufacturing teams, design teams, Q&R organizations, and platform integration to achieve technology and business milestones.
Establish clear accountability, track actions, challenge roadblocks, and ensure commitments are delivered on schedule.
Drive yield readiness assessments, risk mitigation plans, and executive communications for program reviews.
Define and scale the yield intelligence infrastructure needed for EMIB-T, including dashboards, automated analytics, computer vision, AI/ML defect detection, and automated defect classification.
Enable successful EMIB-T deployment and scaling across multiple products and business groups, supporting both IFS and IPG programs.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

Masters degree with 6+years or PhD with 4+years in Engineering, Materials Science, Physics, Chemistry, Data Science, or a related technical discipline.
5+ years of experience in semiconductor manufacturing, advanced packaging, substrate technology, yield engineering, process engineering, or a closely related field.
Hands-on experience in substrate, advanced packaging, or semiconductor yield engineering, including statistical analysis, defect reduction, process optimization, SPC, DFM/DFY, defect metrology, failure analysis, and HVM execution.
Strong analytical and problem-solving skills with the ability to make data-driven decisions in complex environments.
Experience working across multiple organizations and influencing stakeholders to achieve results.
Demonstrated ability to independently manage complex technical issues, execute with urgency, and drive actions to closure.
Experience developing or deploying yield monitoring systems, automated analytics, dashboards, image analytics, computer vision, AI/ML-based defect detection, or automated defect classification systems.

Preferred Qualifications

Experience working directly with substrate suppliers and external manufacturing partners.
Demonstrated program leadership experience, including coordinating cross-functional technical teams and driving execution in high-visibility, high-impact environments.
Experience with advanced packaging technologies, including EMIB, EMIB-T, TSV, 2.5D/3D integration, substrates, or heterogeneous integration.
Prior experience supporting technology development, qualification, and manufacturing ramp of advanced semiconductor technologies.

Join us at Intel to contribute to technological advancements while building a rewarding and impactful career. Apply now to be a part of our extraordinary journey.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $180,770.00-255,200.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

How we rate this

EMIB-T Substrate Yield Lead at Intel rates 60 out of 100 for how much of the daily work is AI. That makes it Works on AI (AI Level 3 of 4). The level is about AI in the job, not seniority.

Classification

Works on AI. The daily work is on AI products, without building the model.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.

Key facts

EMIB-T Substrate Yield Lead is an open job at Intel.
Level rates this role AI Level 3 of 4: Works on AI.
The listed salary is $181k-$255k a year.
The role is based in US, Arizona, Phoenix.
The job was posted on August 17, 2026.
Seniority: lead.
Applications are handled by Intel. Apply on Intel

Prepare for this job

Built from this posting and from similar jobs on Level.

Skills and AI tools this role asks for

Computer visionYield ManagementAdvanced PackagingDefect ReductionCross Functional LeadershipMachine learningDashboardsAutomated Analytics

Questions you could be asked

Walk me through a computer vision problem you solved, from raw data to a deployed model.
Tell me about a project where yield management was part of your work. What did you do?
Tell me about a project where advanced packaging was part of your work. What did you do?
Tell me about a project where defect reduction was part of your work. What did you do?
Tell me about a project where cross functional leadership was part of your work. What did you do?

Adapt your resume

List these exact terms on your resume: Computer vision, Yield Management, Advanced Packaging, Defect Reduction, and Cross Functional Leadership. An applicant tracking system matches the wording, not the idea.
Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.
Show where AI is part of your daily process, not a one-off project. This role expects it to be a running habit.

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