Hybrid C2C - BEOL Module Integration Engineer
Samsung Electronics is hiring a Hybrid C2C - BEOL Module Integration Engineer in Austin, United States. It pays $106k-$145k a year and Level rates it ; you can apply on Samsung Electronics.
Level's read on this job
- Level rates this role Little AI ●○○○: aI is not part of the work.
- Tools and skills the posting cites include semiconductor manufacturing, module integration and wafer bonding.
- Level classifies it as a senior role.
- Level lists 596 other open roles at Samsung Electronics.
AI in this role
Lead development and manufacturing integration of advanced wafer bonding technologies for next-gen semiconductor image sensors.
About Samsung Austin Semiconductor
Samsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At Samsung Austin Semiconductor, we are Innovating Today to Power the Devices of Tomorrow.
Come innovate with us!
Position Summary
In your role as a Copper-to-Copper (C2C) Bonding Expert, you'll be responsible to lead the development, optimization, and manufacturing integration of advanced wafer bonding technologies for next-generation CMOS Image Sensors (CIS).You'll use your expertise to drive innovations in hybrid bonding processes enabling stacked image sensors with superior yield, performance and reliability.
Role and Responsibilities
Here's what you'll be responsible for:
- Enable 1st of a kind C2C bonding process at Samsung Austin - Own Module Integration for Bonding and farBEOL steps within the Process flow.
- Own all Systematic Yield/Reliability related issues for these steps.
- Lead projects to cure these systematics from the technology and/or improve detection for them.
- Own critical dimension targeting and variation control within the Module.
- Review Yield, Cost, Throughput related Process changes across the factory at Change Control Board.
- Provide Yield risk assessment and failure modeling for factory incidents at Material Review Board.
Skills and Qualifications
Here's what you'll need:
- Bachelor’s Degree (or higher) in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related field
- 5+ years of experience in Far BEOL Process/Module Integration in semiconductor manufacturing + 3+ years of Bonding experience is required. 10+ years of experience in Process/Module Integration highly preferred.
- Expert understanding of overall process flow in assigned areas - Demonstrated understanding of the interactions between process and yield, product performance and reliability.
- Prior knowledge in fab unit processes (including Lithography, Etch, Diffusion, Thin Films Deposition, Wet Cleans, CMP, etc.) highly preferred.
The current base salary range for this role is between $106,000.00 - $145,000.00. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifications and experience. Total compensation for this position will include a competitive benefits package and may include participation in company incentive compensation programs, which are based on factors to include organizational and individual performance.
Total Rewards
At Samsung Austin Semiconductor, base pay is just one part of our total compensation package. The base compensation for this role will depend on education, experience, skills, and location.
We offer a comprehensive benefits package, including:
Medical, dental, and vision insurance
Life insurance and 401(k) matching with immediate vesting
Onsite café(s) and workout facilities
Paid maternity and paternity leave
Paid time off (PTO) + 2 personal holidays and 10 regular holidays
Wellness incentives and MORE
Eligible full-time employees (salaried or hourly) may also receive MBO bonuses based on company, division, and individual performance.
All positions at Samsung Austin Semiconductor are full-time on-site.
U.S. Export Control Compliance
This role may require access to information subject to U.S. export control laws. Applicants must be authorized to access such information or eligible for government authorization.
Trade Secrets Notice
By submitting an application, you agree not to disclose to Samsung—or encourage Samsung to use—any confidential or proprietary information (including trade secrets) belonging to a current or former employer or other entity.
* Please visit Samsung membership to see Privacy Policy, which defaults according to your location. You can change Country/Language at the bottom of the page. If you are European Economic Resident, please click here.
* Samsung Electronics America, Inc. and its subsidiaries are committed to Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, status as a protected veteran, genetic information, status as a qualified individual with a disability, or any other characteristic protected by law.
How we rate this
Hybrid C2C - BEOL Module Integration Engineer at Samsung Electronics rates 0 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.
Little AI. AI is not part of the work.
- ●●●● Builds AI80 to 100
- ●●●○ Works on AI60 to 79
- ●●○○ Uses AI40 to 59
- ●○○○ Little AI0 to 39
Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.
Prepare for this job
Built from this posting and from similar jobs on Level.
Skills and AI tools this role asks for
Questions you could be asked
- Tell me about a project where semiconductor manufacturing was part of your work. What did you do?
- Tell me about a project where module integration was part of your work. What did you do?
- Tell me about a project where wafer bonding was part of your work. What did you do?
- Tell me about a project where yield optimization was part of your work. What did you do?
Adapt your resume
- List these exact terms on your resume: Semiconductor Manufacturing, Module Integration, Wafer Bonding, and Yield Optimization. An applicant tracking system matches the wording, not the idea.
- Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.
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