Low Yield Analysis Engineer on Shift

Intel is hiring a Low Yield Analysis Engineer on Shift. It pays $99k-$140k a year and Level rates it ; you can apply on Intel.

Level's read on this job

Little AI ●○○○ is how Level rates this role: aI is not part of the work.
The posting mentions electrical characterization, failure analysis and semiconductor manufacturing among its tools and skills.
Level classes it as a mid-level role.
Intel has 860 other open roles on Level.

AI in this role

Low Yield Analysis Engineer responsible for electrical characterization, failure analysis, and yield improvement in semiconductor manufacturing.

electrical-characterizationfailure-analysissemiconductor-manufacturingdata-analysisproject-management

Job Details:

Job Description:

APTD LYA is a Foundry Labs Network organization that supports back-end package assembly and wafer level assembly sort and test fails to help root cause yield loss and in-line failures. In this electrical-characterization hybrid role, the engineer on shift will be responsible for technical functions such as design, test, checkout, modifications, and characterization of wafer level assembly technologies. Engineers on back or front of week shift schedules will help bridge support between engineering technicians, as well as shift 1 engineers and module partners, yield support, integration and both internal and external customers in a collaborative environment. As an LYA Engineer, you will set priorities for the platform/project, get results across boundaries, and ensure an inclusive work environment. In this role, engineers can expect to work with a team of engineers and engineering technicians to conduct various analyses and engineering tests to provide platforms with root cause determination of in-line electrical failures and perform defect and/or process characterization in support of identifying key mechanisms that contribute to root cause identification. Your main responsibilities include, but are not limited to: - Working across team boundaries to achieve strategic objectives and meet program deliverables. - Understand program milestones and schedules then translate into team objectives and drive execution. - Interface with a wide variety of internal teams, as well as external suppliers to improve yield and drive innovation. - Project management, package design and/or development and sustaining support for integrated circuit or semiconductor assemblies, as well as various other electronic components and/or completed units. - Conduct hands-on lab work, define data acquisition strategy and data analysis plan, and recommend corrective actions and/or fixes to internal customers. - Develop failure analysis innovative techniques, BKMs, and/or approaches to accelerate failure identification and mechanism understanding. - Provide consultation concerning packaging and/or assembly problems and improvements in the manufacturing process. - Respond to customers' requests or events as they occur. - Candidate should be capable of working effectively across organizational boundaries. - Candidate must exhibit the following traits/skills: Work with ambiguity and flexibility with respect to job roles and working hours, have strong analytical and problem-solving skills, and possess robust communication and presentation skills. This role is lab-based and on-site required.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through schoolwork and/or classes and/or project work and/or internships and/or military training and/or work experience. Minimum Qualifications: Must possess a Bachelor's Degree with at least 2 years of experience or Master's Degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or Chemistry and Physics or related field. Preferred Qualifications: • Prior experience working in a lab environment. • Experience with destructive and optical analysis techniques such as manual cross-sectioning and delayering, SEM, x-ray, microscopy, CSAM, ion milling, TEM and FIB • Experience performing electrical fault isolation and failure analysis on product and TV through the use of hand probe, curve trace, auto probing, TDR, EOTPR, EBAC, RIDR, and/or ELITE. • Experience with chemical compositional analysis techniques such as EDX. AFM, FTIR, Raman, and diffraction techniques such as XRD and EBSD. • Knowledge of package or die mapping software EX: Mentor Graphics, SysNav/CadNav, FIELD and expertise in SQL scripting and basic statistical analysis tools such as JMP are a plus. • Ability to communicate findings verbally and through reports to yield engineers, LYA analysts, and other customers. • Ability to work in a collaborative manner with a variety of different individuals in a fast paced, technical environment. • Ability to work effectively in an ambiguous environment where changing priorities and the norm.

Job Type:

Experienced Hire

Shift:

Shift 7 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $99,030.00-139,810.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

How we rate this

Low Yield Analysis Engineer on Shift at Intel rates 0 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.

Key facts

Low Yield Analysis Engineer on Shift is an open job at Intel.
Level rates this role AI Level 1 of 4: Little AI.
The listed salary is $99k-$140k a year.
The role is based in US, Oregon, Hillsboro.
The job was posted on September 18, 2026.
Seniority: mid.
Applications are handled by Intel. Apply on Intel

Prepare for this job

Built from this posting and from similar jobs on Level.

Skills and AI tools this role asks for

Electrical CharacterizationFailure AnalysisSemiconductor ManufacturingData AnalysisProject Management

Questions you could be asked

Tell me about a project where electrical characterization was part of your work. What did you do?
Tell me about a project where failure analysis was part of your work. What did you do?
Tell me about a project where semiconductor manufacturing was part of your work. What did you do?
Tell me about a project where data analysis was part of your work. What did you do?
Tell me about a project where project management was part of your work. What did you do?

Adapt your resume

List these exact terms on your resume: Electrical Characterization, Failure Analysis, Semiconductor Manufacturing, Data Analysis, and Project Management. An applicant tracking system matches the wording, not the idea.
Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.

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