Module Engineering - Day Shift 5 or 7

Intel is hiring a Module Engineering - Day Shift 5 or 7 in Phoenix, United States. It pays $99k-$140k a year and Level rates it ; you can apply on Intel.

Level's read on this job

Little AI ●○○○ is how Level rates this role: aI is not part of the work.
The posting mentions spc, doe and manufacturing among its tools and skills.
Level classes it as a mid-level role.
Intel has 842 other open roles on Level.
Posted within the past two weeks.

AI in this role

Develop and optimize assembly processes and equipment for advanced packaging solutions in semiconductor manufacturing.

spcdoemanufacturingsemiconductor-packagingreliability-engineering

Job Details:

Job Description:

At Intel, we create world-changing technology that improves the life of every person on the planet. Intel's Foundry Technology Manufacturing business unit is at the forefront of delivering advanced packaging solutions for a broad ecosystem of global customers. We collaborate with world-class engineers, contribute to cutting-edge technology development, and directly impact the quality and performance of products that power the global tech industry. This is your opportunity to grow your career while helping define the future of foundry manufacturing.

We are seeking a Foundry Packaging Module Engineer to join our operations in Chandler, Arizona. In this role, you will develop and optimize assembly processes and equipment, applying innovative concepts to enable Intel's next-generation foundry packaging platform technologies. You will work at the intersection of engineering, manufacturing, and technology development to deliver world-class packaging solutions, evaluate silicon and package technologies under simulated field conditions, and manage raw material specifications to meet our foundry customers' unique needs.

Shift Options:

Shift 5: Day Shift Compressed Work Week (6:00 AM – 6:00 PM; Sunday–Tuesday and alternating Wednesdays)
Shift 7: Day Shift Compressed Work Week (6:00 AM – 6:00 PM; Thursday–Saturday and alternating Wednesdays)

Key Responsibilities:

Process & Equipment Development: Design and develop assembly processes and hardware configurations, using novel engineering concepts to advance Intel's foundry packaging roadmap.
Reliability & Stress Evaluation: Develop, calibrate, and maintain equipment used to evaluate silicon and packaging technologies under simulated field conditions (including thermal cycling, heat, humidity, and mechanical stress).
Vendor & Material Qualification: Establish raw material specifications for contract assemblers and material vendors, partnering with supplier quality and procurement to enforce process compliance.
Early Failure Detection: Create and implement new reliability screening techniques, acceleration methods, and quality screens to enable early detection of potential packaging defects.
Process Control & Characterization: Apply Statistical Process Control (SPC) and Design of Experiments (DOE) principles to define equipment specifications, optimize yields, and document results in technical white papers.
Design-for-Manufacturability (DFM): Ensure physical layout designs are manufacturable within foundry process flows, overseeing the full cycle of package manufacturing procedures.
Technical Consultation: Serve as a technical resource for foundry packaging challenges, responding to customer and partner requests and providing guidance on process improvements.
Technology Standardization: Drive standardization across product qualification frameworks and manufacturing quality systems, engaging with technology development teams to mitigate product milestone risks.

As a Successful Candidate, You Will Bring:

Customer-Centric Mindset: Passion for understanding, consulting, and delivering highly specialized technical solutions to external foundry customers.
Analytical Problem Solving: Analytical thinker focused on diagnosing complex mechanical, thermal, and materials-related packaging defects.
Strong Strategic Collaboration: Highly effective at partnering across diverse matrixed teams, global engineering groups, and external supplier networks.
Adaptability & Drive: High level of personal initiative to lead continuous improvement projects and adjust to changing product priorities.

Apply today to join Intel Arizona's Foundry Technology Manufacturing team. Collaborate with global pioneers, lead advanced reliability initiatives, and build a rewarding engineering career.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience. This Position is not eligible for Intel immigration sponsorship.

Minimum Qualifications:

Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study with 1+ year of relevant experience. -OR- Master's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study.
6+ months of experience with Statistical Process Control (SPC)and/or Design of Experiments (DOE)principles.

Preferred Qualifications:

1+ years of experience:
- Working inside a technology development or semiconductor manufacturing environment.
- Semiconductor packaging processes, including assembly, material selection, or reliability engineering within a foundry context.

Job Type:

Experienced Hire

Shift:

Shift 7 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $99,030.00-139,810.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

How we rate this

Module Engineering - Day Shift 5 or 7 at Intel rates 0 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.

Key facts

Module Engineering - Day Shift 5 or 7 is an open job at Intel.
Level rates this role AI Level 1 of 4: Little AI.
The listed salary is $99k-$140k a year.
The role is based in US, Arizona, Phoenix.
The job was posted on October 23, 2026.
Seniority: mid.
Applications are handled by Intel. Apply on Intel

Prepare for this job

Built from this posting and from similar jobs on Level.

Skills and AI tools this role asks for

SpcDoeManufacturingSemiconductor PackagingReliability Engineering

Questions you could be asked

Tell me about a project where spc was part of your work. What did you do?
Tell me about a project where doe was part of your work. What did you do?
Tell me about a project where manufacturing was part of your work. What did you do?
Tell me about a project where semiconductor packaging was part of your work. What did you do?
Tell me about a project where reliability engineering was part of your work. What did you do?

Adapt your resume

List these exact terms on your resume: Spc, Doe, Manufacturing, Semiconductor Packaging, and Reliability Engineering. An applicant tracking system matches the wording, not the idea.
Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.

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