Module Engineering - Day Shift 5 or 7

Intel is hiring a Module Engineering - Day Shift 5 or 7 in Phoenix, United States. It pays $85k-$163k a year and Level rates it ; you can apply on Intel.

Level's read on this job

On Level's scale, this role is Little AI ●○○○: aI is not part of the work.
Tools and skills the posting cites include Design Of Experiments, semiconductor packaging and manufacturing execution.
Level classifies it as a mid-level role.
Level lists 860 other open roles at Intel.

AI in this role

Develop and optimize semiconductor packaging assembly processes and equipment for manufacturing foundry platforms.

Design Of Experiments

semiconductor-packagingmanufacturing-executionprocess-engineeringfailure-analysis

Job Details:

Job Description:

Shift 5: (Day shift compressed work week) 6 AM-6 PM (Sunday-Tuesday and alternating Wednesdays).
Shift 7: (Day shift compressed work week) 6 AM-6 PM (Thursday-Saturday and alternating Wednesdays).

About the Role
Join Intel's Foundry Technology Manufacturing business unit and play a key role in shaping the future of semiconductor packaging. As a Module Engineer, you will develop and optimize assembly processes and equipment, applying innovative concepts to enable Intel's next-generation foundry packaging platform technologies. You will work at the intersection of engineering, manufacturing, and technology development to deliver world-class packaging solutions for our foundry customers.

What You Will Do

Design and develop assembly processes and equipment, applying novel engineering concepts to advance Intel's foundry packaging roadmap and platform technologies.
Optimize manufacturing efficiency for foundry packages, developing processes that meet rigorous quality, reliability, cost, yield, productivity, and manufacturability requirements specific to foundry customer needs.
Define process and equipment specifications using Design of Experiments (DOE) and data analysis principles, documenting innovations and improvements through technical white papers.
Develop and maintain equipment used to evaluate silicon and package technologies under simulated field conditions, including thermal cycling, heat, humidity, and dynamic mechanical stress testing.
Ensure physical package designs are manufacturable within foundry process flows, and oversee the full cycle of package manufacturing processes, procedures, and production flows.
Establish material specifications for contract assemblers and raw material vendors, partnering closely with supplier quality and procurement teams to enforce process compliance and vendor performance standards.
Create new reliability screening techniques, acceleration methods, and quality tools to enable early detection of potential packaging quality and reliability risks within the foundry manufacturing environment.
Define reliability requirements aligned to foundry customer needs, and influence design decisions, material selection, and process development based on a fundamental understanding of failure mechanisms.
Lead continuous improvement initiatives using statistical methods and experimental design to innovate, troubleshoot, and enhance equipment and process performance.
Serve as a technical resource for foundry packaging challenges, responding to customer and partner requests and providing consultation on process improvements.
Drive standardization across product qualification frameworks, manufacturing quality systems, and methodologies, while actively engaging with packaging technology development and partner engineering teams to assess process maturity and mitigate risks to key product milestones.

Qualifications:

The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

US Citizenship required.
Bachelor's degree with 1+ years of experiencein one of the following fields: Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study.

-OR-

Master's degreein Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study.
6+ months of experience withStatistical Process Control (SPC)and/orDesign of Experiments (DOE)principles.

Preferred Qualifications

Prior experience working in atechnology or semiconductor manufacturing environment.
Experience in semiconductor packaging processes, including assembly, materials, or reliability engineering within a foundry context.

Why Intel Foundry Technology Manufacturing?

Intel's Foundry Technology Manufacturing business unit is at the forefront of delivering advanced packaging solutions for a broad ecosystem of customers. You will collaborate with world-class engineers, contribute to cutting-edge technology development, and directly impact the quality and performance of products that power the global technology industry. This is your opportunity to grow your career while helping define the future of foundry manufacturing.

Job Type:

Experienced Hire

Shift:

Shift 5 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $85,200.00-162,500.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

How we rate this

Module Engineering - Day Shift 5 or 7 at Intel rates 0 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.

Key facts

Module Engineering - Day Shift 5 or 7 is an open job at Intel.
Level rates this role AI Level 1 of 4: Little AI.
The listed salary is $85k-$163k a year.
The role is based in US, Arizona, Phoenix.
The job was posted on October 12, 2026.
Seniority: mid.
Applications are handled by Intel. Apply on Intel

Prepare for this job

Built from this posting and from similar jobs on Level.

Skills and AI tools this role asks for

Semiconductor PackagingManufacturing ExecutionProcess EngineeringFailure AnalysisDesign Of Experiments

Questions you could be asked

Tell me about a project where semiconductor packaging was part of your work. What did you do?
Tell me about a project where manufacturing execution was part of your work. What did you do?
Tell me about a project where process engineering was part of your work. What did you do?
Tell me about a project where failure analysis was part of your work. What did you do?
Walk me through how you've used Design Of Experiments in your day-to-day work.

Adapt your resume

List these exact terms on your resume: Semiconductor Packaging, Manufacturing Execution, Process Engineering, Failure Analysis, and Design Of Experiments. An applicant tracking system matches the wording, not the idea.
Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.

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