Senior Mechanical Packaging Engineer

Nokia is hiring a Senior Mechanical Packaging Engineer. Level rates it ; you can apply on Nokia.

Level's read on this job

On Level's scale, this role is Little AI ●○○○: aI is not part of the work.
Level classes it as a senior role.
Nokia has 568 other open roles on Level.

AI in this role

As part of Nokia’s Advanced Packaging R&D team, you will be responsible for the mechanical development of next generation, high performance electro-optic modules. You will be responsible for the integration of Silicon Photonics based Coherent optical transceivers within Nokia’s Photonic Service Engines, from inception stage to New Product Introduction.

Lead Package Design and Architecture in collaboration with cross-functional teams and stakeholders to ensure package requirements are met.
Innovate designs, applying Design for Manufacturing principles and with an eye towards production volumes and cost targets.
Drive key technology development to enable next generation product design.
Perform FEA structural analysis, including linear, nonlinear and dynamic studies using software.
Perform thermal analysis, and coupled-physics involving thermal–structural, thermal-mechanical stress and thermo-electric analyses.
Own and maintain mechanical drawings and manufacturing documentation along with Bill of Materials for new products.
Plan and Drive prototype assembly builds to enable deliveries for early design validation.
Drive package debug activities during product validation and qualification.
Survey new materials and vendors for all Advanced Packaging activities.
Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers.

You have:

Advanced Degree in Mechanical Engineering or similar field.
5-8 years of extended experience in high-volume packaging of 2.5/3D packages.
Expertise in next generation advanced photonics packaging technologies.
Expertise in 3D CAD design, tolerance analysis, and Geometric Dimensioning and Tolerancing (GD&T) with SolidWorks or similar software.
Expertise in thermal and thermo-mechanical simulations using ANSYS or similar software.
Experience with package and process design/development from design to production.
Expertise in material properties and yield/failure mode analysis.
Experience with documentation of fabrication, inspection, and assembly processes.
Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging.
Expertise in materials property and process, yield analysis and enhancement, and failure mode and analysis.
Experience with Industry Test Standards, such as JEDEC, EIA, Telcordia, Mil-Std, etc.

It would be nice if you also have:

Experience in optical coupling design and assembly for optical engines.
Experience in multilayer material bonding and heterogeneous integration.
Experience in high-speed signal integrity design and analysis.

How we rate this

Senior Mechanical Packaging Engineer at Nokia rates 37 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.