Sort Interface Pathfinding and Development Engineer

Job Description: 

Intel Corporation is one of the world's leading semiconductor companies, driving innovation across computing, connectivity, and artificial intelligence. With a bold vision to shape the future of technology, Intel is transforming how the world processes, stores, and communicates data. Our Advanced Packaging ,Test and Manufacturing (APTM) organization is at the forefront of this transformation, delivering industry-leading packaging and test technologies that power products across Client, Data Center, AI, Networking, and External Foundry markets. At Intel, we believe the next big thing starts with you.

We are seeking a talented and driven Sort Interface Pathfinding and Development Engineer to join our Sort Interface Development team in Oregon. In this high-impact role, you will pioneer breakthrough silicon interface probing & test solutions that enable best-in-class die and wafer sort capabilities across leading-edge process nodes and advanced heterogeneous packaging platforms — including EMIB, EMIB-T, Foveros, and Foveros Direct.

As Intel scales its Open System Foundry and OSAT (Outsourced Semiconductor Assembly and Test) business model, you will play an instrumental role in establishing world-class, customer-ready sort interface capabilities. You will lead electro-mechanical pathfinding, test hardware development, customer and supplier technical co-design, and probing process qualification to support both Intel's internal product roadmap and external Foundry customers.

Key Responsibilities:

• Formulate and execute rigorous Design of Experiments (DOE) to optimize and qualify next-generation probing technologies and contact architectures for wafer and die sort operations
• Serve as the lead technical liaison for Foundry and OSAT customers, translating complex chiplet and package requirements into scalable sort interface specifications
• Author industry-standard sort design rules and Interface Design Kits (IDKs) to streamline ecosystem integration for external fabless customers and design partners
• Collaborate with customer design and DFT teams to architect test interface hardware, resolve technical gaps, and synchronize testability roadmaps
• Partner with global Test Solution vendors and PCB suppliers to pioneer state-of-the-art probing capabilities
• Direct supplier and pathfinding initiatives to align vendor roadmaps with internal efficiency and performance goals
• Drive supplier accountability and manufacturing readiness to guarantee on-time hardware delivery for critical New Product Introductions (NPI)

As a Successful Candidate, You Will Bring:

• Collaborative mindset — you thrive working across cross-functional teams, customers, and global suppliers
• Strong communicator — you can translate highly technical concepts into clear, actionable specifications for diverse audiences
• Analytical thinker — you approach complex problems with curiosity, structure, and data-driven decision-making
• Self-starter — you take initiative, drive projects forward, and hold yourself and others accountable
• Customer-focused — you understand the importance of building trust and delivering value to external partners
• Adaptable — you are comfortable navigating ambiguity and evolving priorities in a fast-paced, cutting-edge environment
• Continuous learner — you stay current with emerging technologies and proactively seek opportunities to grow

If you are passionate about pushing the boundaries of advanced packaging and test technology, and you want to make a meaningful impact on products that power the world's most advanced computing systems, we want to hear from you.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• Bachelor’s degree in electrical engineering, Mechanical Engineering, Materials Science, or a related STEM field with 6+ years of industry experience OR Master's degree in the same fields with 4+ years of industry experience OR Ph.D. in the same fields with 2+ year of relevant post-graduate or industry experience
• Relevant industry experience can be any of the following:
  • Experience with wafer/die sort Technology, prober-tester cell integration, and qualification of advanced probe card technologies
  • Structure and execute DOEs to evaluate probing margins, yield, and process health
  • Direct experience in ATE test hardware/methodology, Sort/Class product development, or PCB/space transformer/substrate design rules and stackup architectures

Preferred Qualifications:

• 6+ years of experience in:
  • Advanced probing process characterization
  • Direct experience managing technical relationships with external probe card/substrate suppliers or providing test hardware application support to external foundry/OSAT customers
  • Knowledge of OSAT/Foundry test operations, multi-client test cell standards, customer design collateral/PDK enablement, or turnkey test delivery models
  • Experience qualifying probe technologies for fine-pitch micro-bumps, 2.5D/3D architectures (EMIB, EMIB-T, silicon bridges), or wafer-level chip-scale probing
  • Hands-on experience with commercial ATE platforms such as Advantest V93k or Teradyne Ultra-FLEX

Job Type:

Shift:

Primary Location: 

Additional Locations:

Posting Statement:

Position of Trust

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Work Model for this Role

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