Staff Assembly Process Engineer

Nokia is hiring a Staff Assembly Process Engineer. Level rates it ; you can apply on Nokia.

Level's read on this job

On Level's scale, this role is Little AI ●○○○: aI is not part of the work.
Level classifies it as a lead role.
Level lists 568 other open roles at Nokia.
The role was posted within the past two weeks.

AI in this role

Develop, sustain, and improve process yield for die attach, wirebond, inspection tools and/or process steps in the assembly of monolithically integrated optical circuits in 24x7 manufacturing and development facility. Focus on both process and tool ownership, process, equipment performance (MTBA, MTBF) and NPI.

Responsibilities include

Become a process owner of many specific COC assembly processes, primarily wirebond and eutectic die attach.
Peer-lead and develop expertise in specific assembly process modules as well as across the manufacturing process flow.
Organize, analyze, and improve manufacturing processes to meet key performance indicators including efficiency, cycle time, yield, and reliability.
Identify and reduce components of variability by conducting controlled experiments, analyzing, summarizing, and presenting results.
Work in a team environment consisting of engineers, technicians and operators.
Create written operational procedures and mentor/train operators.
Responsible for New Tool selection , procurement , installation, and qualifying new tools.
Work with development and other functional teams to define the assembly requirements for new product introduction.
Identify, develop, and qualify new assembly processes and technologies to enable and support next generation product needs.
Represent Assembly Engineering in various multi-functional teams.
Work in a clean room environment and follow strict clean room requirements.
Must be available for 24/7 factory on call.

Skills / Experience / Knowledge

Strong hands-on background in assembly technologies and processes for microelectronics manufacturing
Hands-on operation and maintenance of assembly process tools and metrology equipment
Technical expertise and ownership in die attach via solder or epoxy bonding on Micron2/Datacon EVO tool platform.
Wafer fab or Assembly shop floor control systems
Process engineering statistics background (SPC, DOE)
Experience with Failure Analysis
Material and Tool selection
Plasma cleaning equipment and process
Troubleshooting and resolving equipment problems
Hands-on data analysis with JMP, MATLAB, or similar packages
Experience in mentorship and training of operators, engineering technicians, and junior engineers
Ability to work closely and coordinate activities with other functional groups.
Good communication and project management skills
Safety and quality-oriented mindset

Knowledge & Experience

Bachelor’s degree in electrical, Mechanical, Materials Engineering, or related field, plus 8 years of related experience, or master’s degree with 5 years of experience in semiconductor packaging & assembly technology in a manufacturing environment.

How we rate this

Staff Assembly Process Engineer at Nokia rates 33 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.