Substrate Component Engineering Technical Leader

IC Substrate Component Engineering Technical Leader

Meet the Team

You'll be part of the Component Quality & Technology (CQT) within the Global Supplier Management (GSM) organization in Cisco’s Supply Chain Organization. CQT is a key hub of technical innovation in Cisco. Members of the organization focus on evaluating and developing new technologies to enable sustained product differentiation. You will be a part of a diverse team that seamlessly blends different levels of expertise in several areas of semiconductor and systems design combining traditional knowledge with groundbreaking data analytics techniques to tackle increasingly sophisticated problems. You will regularly engage with Cisco Business Units as your partners and customers, Suppliers of the commodity space you are managing and extended Supply Chain functions including Global Supply Management, Product Operations and Global Manufacturing Organization.

Your Impact

We are looking for a highly motivated professional with a strong background in IC Substrate to join our team. In this role, you will collaborate with various Cisco teams and industry partners to help develop next-generation Substrate solutions and ensure these solutions meet Cisco’s high standards.

Key Responsibilities:

• Partner with Cisco development engineers, commodity teams, and suppliers to create innovative IC Substrate solutions.
• Contribute to the development of IC Substrate commodity strategy.
• Participate in the IC Substrate supplier selection process. Assess and qualify IC Substrate suppliers. Take part in technical and process audits of suppliers as needed.
• Lead IC Substrate failure analysis and drive containment, corrective actions, and risk assessment.
• Work closely with manufacturing and engineering teams to resolve complex technical issues.

• Collaborate with cross-functional teams across the organization. Effectively communicate complex technical concepts and solutions.

Minimum Qualifications:

• Possess MS degree in Engineering/Chemistry/Material degree or equivalent, plus 15+ years IC Substrate manufacturing experience
• Solid understanding and direct experience in IC Substrate and SLP (substrate like PCB), mSAP process (modified semi-additive process) design specifications and requirements, qualification, manufacturing fabrication and test.
• Competency in failure analysis techniques such as FMEA, 8D/Corrective Action, Fishbone IFD, Cause and Effect Analysis, Design of Experiments (DOE), and risk assessment.

• Experienced in managing supplier relationships and implementing corrective actions and rigorous quality control measures to ensure product standards and reliability are consistently met.

Preferred Qualifications:

• Strong problem solving and conflict resolution skills along with customer focus, decision-making, influencing and ability to meet deadlines.

• Familiarity of IC Substrate materials (laminates and resins), Signal Integrity, reliability knowledge, and experience.

• Lead multiple technical projects and manage day-to-day work while also focusing on long term goals
• Focused on teamwork and collaboration, participating in and leading cross organizational projects.

Why Cisco

At Cisco, each person brings their unique talents to work as a team and make a difference.

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At Cisco, we’re revolutionizing how data and infrastructure connect and protect organizations in the AI era – and beyond. We’ve been innovating fearlessly for 40 years to create solutions that power how humans and technology work together across the physical and digital worlds. These solutions provide customers with unparalleled security, visibility, and insights across the entire digital footprint.

Fueled by the depth and breadth of our technology, we experiment and create meaningful solutions. Add to that our worldwide network of doers and experts, and you’ll see that the opportunities to grow and build are limitless. We work as a team, collaborating with empathy to make really big things happen on a global scale. Because our solutions are everywhere, our impact is everywhere.

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