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IntelTEM Technician
AI in this role
Perform ultra-thin specimen preparation and TEM analysis to support advanced semiconductor technology development.
Job Description:
The Process Integration and Yield Technician will be responsible for but not limited to: In this position, you will work in an exciting electron microscopy lab supporting Intel's advanced technology development. Responsible for making ultra-thin specimens and/or performing TEM analysis in support of process/product development, qualification and failure analysis. Requires use of dual beam FIB for TEM sample preparation and/or TEM for imaging and analysis. Continuous upgrading of skillset requires open attitude and ability to learn from others. Work is completed according to general instructions and prioritization. Some degree of judgment is required in resolving non-standard problems. Maintain necessary records and reports. Performs other related duties as required or as directed. • Technical functions in support of engineering activities such as fabrication, failure analysis, technology development, process development, and process integration. • Conducts engineering tasks and detailed technical procedures to perform sample preparation or imaging using advanced focused-ion-beam and/or transmission electron microscope tools in support of the research and development activities of Intel. • Work is completed according to general instructions. • Some degree of judgment is required in resolving nonstandard problems. • Performs other related duties as required or as directed. • Continuous upgrading of skillset; requires an open attitude and skills to learn from others.Qualifications:
Minimum Qualifications: Candidate must possess at least one of the following: • Associate's or Bachelor's degree in a Technical Area (Electrical, Mechanical, Electronics Technology, Material Science or comparable field). • 1 + years of hands-on Lab and or manufacturing experience. • Technical Certification. • 1 + years of military-relevant experience. Preferred qualifications: • Hands-on experience with sample preparation using FIB/SEM and/or Transmission Electron Microscopy (TEM) operation.
Job Type:
Experienced HireShift:
Shift 6 (United States of America)Primary Location:
US, Oregon, HillsboroAdditional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $70,670.00-99,770.00 USD (Hourly Role)
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.How we rate this
TEM Technician at Intel rates 0 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.
Little AI. AI is not part of the work.
- ●●●● Builds AI80 to 100
- ●●●○ Works on AI60 to 79
- ●●○○ Uses AI40 to 59
- ●○○○ Little AI0 to 39
Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.
Prepare for this job
Built from this posting and from similar jobs on Level.
Skills and AI tools this role asks for
Questions you could be asked
- Tell me about a project where electron microscopy was part of your work. What did you do?
- Tell me about a project where sample preparation was part of your work. What did you do?
- Tell me about a project where failure analysis was part of your work. What did you do?
- Tell me about a project where process integration was part of your work. What did you do?
- Walk me through how you've used Fib in your day-to-day work.
Adapt your resume
- List these exact terms on your resume: Electron Microscopy, Sample Preparation, Failure Analysis, Process Integration, and Fib. An applicant tracking system matches the wording, not the idea.
- Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.
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