Thin Films Module Development Engineer

Intel is hiring a Thin Films Module Development Engineer. It pays $134k-$189k a year and Level rates it ; you can apply on Intel.

Level's read on this job

Level rates this role Little AI ●○○○: aI is not part of the work.
Tools and skills the posting cites include Ald, Cvd and Pvd.
Level classifies it as a senior role.
Level lists 860 other open roles at Intel.

AI in this role

Drive thin film metal deposition process development and optimization for advanced semiconductor technologies.

AldCvdPvd

thin-filmsmetals-depositionmaterials-sciencesemiconductor-manufacturingstatistical-analysis

Job Details:

Job Description:

Intel Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development (TD) organization to accelerate development of advanced process development for applications in high-k/metal gate, contact, and interconnect. In this role you will be responsible for delivering metals process definition, development, and optimization in metal deposition modules.

Core Responsibilities:

Primary ownership of thin film metal deposition process development across ALD, CVD, PVD, electrochemical deposition, and related process platforms
Design, implement, and optimize processes to meet specifications for materials, device performance, yield, and process control
Design, execute, and analyze experiments to meet integrated device requirements and support rapid yield improvement
Apply expert knowledge of equipment operating principles, materials characterization and metrology, and device characteristics to accelerate technology development learning cycles
Support novel material and process screening and evaluation, equipment selection, on-time install/qualification of first-of-kind equipment, and design for manufacturability
Partner with cross-functional teams including process integration, device engineering, metrology, yield, manufacturing, and equipment suppliers
Contribute to process pathfinding efforts for next-generation semiconductor technologies through evaluation of novel materials, hardware assessment, process screening, integration development, and silicon validation

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications:

PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, or a closely related STEM field

With at least 1+ years of experience in:

Working knowledge of one or more thin film deposition technologies such as ALD, CVD, PVD, sputtering, evaporation, electrochemical deposition, or related vacuum process technologies
Demonstrated ability to analyze process data using statistical methods, structured troubleshooting, and robust experimental design

Preferred Qualifications:

Experience in thin film metal deposition process development for high-k/metal gate stack, contact metallization, or Cu interconnect barrier/liner/plating
Experience with materials characterization and metrology methods such as XRF, XPS, XRD, SEM, TEM, ellipsometry, e-test, defect inspection, reliability, and related techniques
Experience with MOSFET / FinFET / GAA / CFET device characteristics, electrical characterization techniques, and semiconductor device fundamentals
Proficient with data analysis software including JMP, Excel, Python, R, SQL
Strong communication and collaboration skills with demonstrated ability to solve challenging and ambiguous technical problems in a fast-moving and dynamic team environment
Experience using AI-assisted engineering tools to improve technical productivity while maintaining critical independent engineering judgement
Strong written and verbal communication skills with ability to document decisions, summarize technical data, and align cross-functional stakeholders
Availability to work on site and support 24/7 manufacturing operations with on-call rotation

For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information

Job Type:

College Grad

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

How we rate this

Thin Films Module Development Engineer at Intel rates 0 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.

Key facts

Thin Films Module Development Engineer is an open job at Intel.
Level rates this role AI Level 1 of 4: Little AI.
The listed salary is $134k-$189k a year.
The role is based in US, Oregon, Hillsboro.
The job was posted on August 21, 2026.
Seniority: senior.
Applications are handled by Intel. Apply on Intel

Prepare for this job

Built from this posting and from similar jobs on Level.

Skills and AI tools this role asks for

Thin FilmsMetals DepositionMaterials ScienceSemiconductor ManufacturingStatistical AnalysisAldCvdPvd

Questions you could be asked

Tell me about a project where thin films was part of your work. What did you do?
Tell me about a project where metals deposition was part of your work. What did you do?
Tell me about a project where materials science was part of your work. What did you do?
Tell me about a project where semiconductor manufacturing was part of your work. What did you do?
Tell me about a project where statistical analysis was part of your work. What did you do?

Adapt your resume

List these exact terms on your resume: Thin Films, Metals Deposition, Materials Science, Semiconductor Manufacturing, and Statistical Analysis. An applicant tracking system matches the wording, not the idea.
Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.

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