Thin Films Module Engineering - PhD Intern

Intel is hiring a Thin Films Module Engineering - PhD Intern. It pays $121k a year and Level rates it ; you can apply on Intel.

Level's read on this job

Level rates this role Little AI ●○○○: aI is not part of the work.
The posting mentions semiconductor manufacturing, thin films and process engineering among its tools and skills.
Level classes it as an internship.
Intel has 798 other open roles on Level.
Posted within the past two weeks.

AI in this role

Develop and sustain semiconductor thin film manufacturing processes and support automation improvements as a PhD intern at Intel.

semiconductor-manufacturingthin-filmsprocess-engineeringdata-analysistroubleshooting

Job Details:

Job Description:

The Role and Impact

As a Module Engineering PhD Intern, you will play a key role in developing and sustaining semiconductor manufacturing processes for a specific module. Your day-to-day responsibilities will include supporting equipment troubleshooting, performing maintenance and qualification activities, and collaborating with engineering teams to optimize process control methodologies. This role offers a unique opportunity to gain hands-on experience in semiconductor manufacturing while building essential skills for a future career in engineering.

Business group

You will join the Intel Foundry team, a dynamic and innovative group dedicated to delivering cutting-edge manufacturing solutions that drive Intel's technology forward. The team focuses on advancing semiconductor fabrication processes in areas such as Diffusion, Dielectrics, Implant, EPI, and FE Metals. As part of this group, you will contribute to Intel's mission of creating world-changing technology that enables global progress and enriches lives.

What We Do

As members of the Manufacturing Development and Customer Engineering (MDCE) team, we are responsible for improving process capability for multiple technology nodes (Intel 18A, Intel 3, Intel 12nm and upcoming technologies) from initial product qualification through high volume manufacturing. The focus will be on delivering yield improvement, performance enhancement, variation and cost reduction.

Key Responsibilities

Assist with the development and implementation of thin film manufacturing processes for a specific module within Intel's semiconductor production.
Support troubleshooting and maintenance activities for manufacturing equipment to ensure optimal performance.
Participate in equipment qualification processes, ensuring compliance with quality and functional standards.
Collaborate with engineering teams to optimize process control methodologies and achieve production targets.
Establish strong working relationships and partner closely with technology development, high volume manufacturing and cross-functional stakeholders to achieve common goals.
Analyze data trends, identify solutions for process improvement and drive automation improvements (using AI where applicable)
Contribute to sustaining and improving manufacturing tools and processes while gaining hands-on experience in semiconductor engineering.

Qualifications:

Minimum Qualifications

Currently pursuing a PhD degree in a relevant STEM discipline (e.g. Physics, Applied Chemistry, Chemical Engineering, Electronic Engineering, Mechanical Engineering, Computer Science, etc.).
Strong analytical and problem-solving skills.
Experience writing software code for application in above majors
Excellent communication skills - both written and verbal.
Ability to work independently and as part of a diverse, high-performing team.
Willingness to work in a cleanroom environment.
Strong attention to detail and disciplined approach to procedures.
Data analysis skills with demonstrated ability to construct clear data-based problem statements, design of experiment.

Preferred Qualifications

Experience with data analysis tools and software (e.g. JMP, Python, Excel, and AI tools).
Ability to summarize data for technical and non-technical audiences.

Please note, the ideal candidate will be open to work a 6-month internship schedule beginning the Spring of 2027 through December 2027.

This is your chance to join a global leader in semiconductor manufacturing, gain real-world experience, and contribute to innovative solutions that shape the future of technology. If you are ready to learn, grow, and make an impact, we encourage you to apply today.

Job Type:

Student / Intern

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $120,898.00-120,902.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

How we rate this

Thin Films Module Engineering - PhD Intern at Intel rates 20 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.

Key facts

Thin Films Module Engineering - PhD Intern is an open job at Intel.
Level rates this role AI Level 1 of 4: Little AI.
The listed salary is $121k a year.
The role is based in US, Oregon, Hillsboro.
The job was posted on October 20, 2026.
Seniority: intern.
Applications are handled by Intel. Apply on Intel

Prepare for this job

Built from this posting and from similar jobs on Level.

Skills and AI tools this role asks for

Semiconductor ManufacturingThin FilmsProcess EngineeringData AnalysisTroubleshooting

Questions you could be asked

Tell me about a project where semiconductor manufacturing was part of your work. What did you do?
Tell me about a project where thin films was part of your work. What did you do?
Tell me about a project where process engineering was part of your work. What did you do?
Tell me about a project where data analysis was part of your work. What did you do?
Tell me about a project where troubleshooting was part of your work. What did you do?

Adapt your resume

List these exact terms on your resume: Semiconductor Manufacturing, Thin Films, Process Engineering, Data Analysis, and Troubleshooting. An applicant tracking system matches the wording, not the idea.
Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.

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