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Intel

Module Development Engineer

Intel is hiring a Module Development Engineer. It pays $134k-$255k a year and Level rates it ; you can apply on Intel.

Level's read on this job

  • Level rates this role Little AI ●○○○: aI is not part of the work.
  • Tools and skills the posting cites include semiconductor processing, fabrication and experiment design.
  • Level classifies it as a senior role.
  • Level lists 842 other open roles at Intel.
  • The role was posted within the past week.

AI in this role

Develop and optimize advanced semiconductor manufacturing processes and innovative device architectures at Intel.

semiconductor-processingfabricationexperiment-designmetrologydevice-architectures
Job Details:

Job Description:

The Role and Impact:
As a Module Development Engineer, you will play a critical role in advancing Intel's semiconductor technologies by developing and optimizing complex manufacturing processes. You will design experiments, analyze results, and collaborate with cross-disciplinary teams to ensure the successful integration of innovative device architectures. Your contributions will directly impact the quality, scalability, and advancement of Intel's technology roadmap, driving industry-leading solutions in semiconductor manufacturing.

Business Group:
As part of Intel Foundry, you will join a forward-thinking team committed to delivering cutting-edge process technologies and enabling advancements in Intel's product roadmap. This group fosters collaboration across diverse scientific disciplines to ensure Intel's leadership in semiconductor innovation. By joining this dynamic team, you will help shape the future of computing and technology.

Key Responsibilities:

  • Design, execute, and analyze experiments to develop next-generation semiconductor processes
  • Develop and optimize advanced manufacturing techniques, including material selection, parameter tuning, and equipment metrology
  • Perform pathfinding activities to enable innovative device architectures and align them with future roadmaps
  • Collaborate with cross-functional teams to integrate individual process steps into cohesive manufacturing flows
  • Partner with equipment and material suppliers to enhance process capabilities and deliver robust solutions
  • Recommend and implement equipment modifications to improve efficiency, scalability, and consistency
  • Drive ramp-up to high-volume manufacturing using Intel's Copy Exactly Methodology
  • Analyze trends in the semiconductor industry and align Intel's technology needs with emerging advancements

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications:

  • Master's degree in STEM related field with 5+ years of semiconductor processing and fabrication experience

OR

  • PhD degree in STEM related field with 3+ years of semiconductor processing and fabrication experience

Preferred Qualifications:

  • Proven expertise in thin films processing or device fabrication with advanced hands-on development experience
  • In-depth knowledge of films processing methodologies and optimization techniques
  • Experience leading cross-functional teams and driving complex technical projects to successful outcomes
  • Familiarity with process control systems, variability sources, and advanced statistical methods
  • Demonstrated ability to communicate technical concepts effectively in a multidisciplinary environment

For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

How we rate this

Module Development Engineer at Intel rates 0 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

  1. ●●●● Builds AI80 to 100
  2. ●●●○ Works on AI60 to 79
  3. ●●○○ Uses AI40 to 59
  4. ●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.

Prepare for this job

Built from this posting and from similar jobs on Level.

Skills and AI tools this role asks for

Semiconductor ProcessingFabricationExperiment DesignMetrologyDevice Architectures

Questions you could be asked

  1. Tell me about a project where semiconductor processing was part of your work. What did you do?
  2. Tell me about a project where fabrication was part of your work. What did you do?
  3. Tell me about a project where experiment design was part of your work. What did you do?
  4. Tell me about a project where metrology was part of your work. What did you do?
  5. Tell me about a project where device architectures was part of your work. What did you do?

Adapt your resume

  • List these exact terms on your resume: Semiconductor Processing, Fabrication, Experiment Design, Metrology, and Device Architectures. An applicant tracking system matches the wording, not the idea.
  • Attach one line of real, concrete experience to at least one of them. A tool named with nothing behind it rarely survives a human read.

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