NM Wafer Packaging Manufacturing: Advanced Packaging Module Engineer

Job Description:

The Role and Impact

Note: This position requires regular onsite presence to perform essential job responsibilities.

New Mexico Wafer Packaging Manufacturing (NMWPM) is expanding, and we are seeking Module Engineers specializing in Wafer-Level Assembly, Die Preparation, and Metrology. These roles will support both high-volume manufacturing (HVM) and technology development activities, including process transfers and product start-ups for Foveros, Embedded Bridge, and Intel Foundry Services (IFS) technologies.

Key Responsibilities

Responsibilities include, but are not limited to:

• Drive sustained operational excellence by proactively identifying and implementing safety and ergonomic improvements, excursion prevention measures, and initiatives that enhance equipment availability, utilization, and cost efficiency.
• Collaborate with partner factories to transfer new processes, maintain Copy Exactly standards, share best practices, and drive continuous improvements in processes and equipment performance.
• Develop and execute technology roadmaps to achieve process requirements, business objectives, and key milestones.
• Install, qualify, and ramp equipment and manufacturing processes to support new product introductions and production start-up milestones.
• Lead efforts to resolve complex technical challenges and implement robust systems that prevent recurrence.
• Support and sustain development and pilot production lines during early test vehicle and production phases.
• Partner closely with engineers, technicians, integration teams, shift leadership, and management to deliver development and manufacturing commitments.
• Evaluate, qualify, and implement new hardware, software, and equipment upgrades.
• Lead critical task forces and cross-functional initiatives related to areas of ownership and adjacent manufacturing processes.

Desired Behavioral Traits

The successful candidate will demonstrate:

• A strong commitment to safety and a proactive approach to promoting a safe work environment.
• The ability to thrive in a dynamic environment with evolving priorities and technical challenges.
• A results-oriented mindset with strong organizational skills, initiative, resourcefulness, and accountability.
• Excellent analytical and problem-solving skills, with a strong sense of urgency and commitment to achieving business objectives.
• The ability to distill complex technical concepts into clear, actionable communication for stakeholders at all organizational levels.
• Proven success working within high-performing teams, including demonstrated leadership, collaboration, prioritization, and problem-solving capabilities.
• A continuous improvement mindset, with experience applying Lean principles and methodologies to drive operational and manufacturing excellence.

Qualifications:

Minimum Qualifications

• Bachelor's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related technical field.
• Completed academic coursework, laboratory work, or technical projects in semiconductor technologies, electronics, or mechanical engineering.

Preferred Qualifications

• 2+ years of relevant experience with a Bachelor's degree, or no prior experience required with a Master's degree.
• Familiarity with semiconductor manufacturing process flows, with an emphasis on advanced packaging technologies.
• Hands-on experience with semiconductor manufacturing equipment, including tool matching, calibration, and performance optimization.
• Demonstrated success in tool installation, qualification, and production readiness activities.
• Working knowledge of Design of Experiments (DOE) methodologies and their application to tool matching, process qualification, and continuous improvement.
• Proficiency in data-driven problem solving and root cause analysis using methodologies such as Model-Based Problem Solving (MBPS), DOE, Statistical Process Control (SPC), and Failure Mode and Effects Analysis (FMEA).

Job Type:

Shift:

Primary Location:

Additional Locations:

Posting Statement:

Position of Trust

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Work Model for this Role

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