Semiconductor Packaging Process Engineering Lead

Intel is hiring a Semiconductor Packaging Process Engineering Lead in Phoenix, United States. It pays $156k-$298k a year and Level rates it ; you can apply on Intel.

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Level rates this role Little AI ●○○○: aI is not part of the work.
Level classes it as a lead role.
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Posted in the last few days.

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Job Details:

Job Description:

Intel Corporation is a global leader in the semiconductor industry, engineering the foundational technologies that power modern computing. Within Intel, the Epoxy Mold Module division plays a pivotal role in developing and scaling world-class semiconductor packaging solutions. By advancing next-generation assembly processes and driving operational excellence, our group directly enables Intel’s product roadmap and delivers innovative, high-quality products to customers worldwide.

We are seeking a visionary and action-oriented Packaging Module Development Manager to lead our engineering team in Arizona. In this critical leadership role, you will guide a specialized team responsible for advancing semiconductor packaging processes and introducing new equipment within a 24x7 manufacturing environment. Your strategic oversight and mentorship will directly resolve complex technical challenges, elevate manufacturing yield and throughput, and shape the future of Intel's packaging capabilities.

Key Responsibilities:

Team Leadership & Mentorship: Lead, mentor, and develop a team of engineers across a 24x7 operation, cultivating technical expertise, clear goal alignment, and differentiated execution.
Process & Equipment Introduction: Guide the deployment, implementation, and optimization of new packaging equipment and process technologies into the manufacturing environment.
Specification Oversight: Direct equipment and process specifications to guarantee strict alignment with operational goals and manufacturing expectations.
Cross-Functional Partnership: Manage shift engineering coverage and build strong partnerships across manufacturing, automation, and partner engineering groups.
Strategic Roadmap Execution: Formulate long-term strategies that advance manufacturing efficiency, yield, throughput, and overall process manufacturability while championing a quality-first culture.

As a Successful Candidate, You Will Bring:

Inspirational Leadership: Proven talent for coaching, mentoring, and empowering engineering teams to achieve high-impact results and career growth.
Results-Driven Accountability: Strong commitment to clear goal setting, structured performance management, and operational excellence.
Strategic Problem Solver: Decisive, analytical mindset suited for navigating complex operational challenges and influencing long-term roadmaps.
Collaborative Influencer: Exceptional communication and interpersonal skills to build consensus and drive alignment across diverse, cross-functional stakeholders.
Quality-First Mindset: Dedication to high standards, continuous improvement, and proactive risk mitigation in a fast-paced environment.

Are you ready to lead a high-performing engineering team and shape the future of semiconductor packaging technology? Apply today to join Intel's Epoxy Mold Module leadership team in Chandler, Arizona!

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience.

Minimum Qualifications:

Bachelor’s Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Physics, or a related STEM field AND 6+ years of professional experience in engineering or manufacturing, relevant experience OR
Master’s Degree in the above fields AND 4+ years of professional experience, relevant experience OR
PhD in the above fields AND 2+ years of relevant experience.
Relevant experience will be any of the following:
- Developing, qualification testing, or releasing semiconductor packaging assembly processes
- Equipment or prior professional ownership of DOE (Design of Experiments), SPC (Statistical Process Control), or JMP/Minitab data modeling to resolve process anomalies or optimize yields.

Preferred Qualifications

4+ years of experience in:
- Semiconductor Assembly Process Technology Development (TD), leading processes from pathfinding through to high-volume manufacturing (HVM) transfer.
- Direct people management or formal team leadership experience, including direct ownership of performance reviews, engineering career development plans, and team resource allocation.
- Specialized Hardware Expertise: Documented experience working directly with, configuring, or troubleshooting one or more of the following equipment types: automated fluid dispense systems, thermal curing/bonding ovens, plasma treatment chambers, or optical/acoustic metrology tools.
- Roadmap Influence & Problem Solving: A documented history of initiating, driving, or influencing equipment development roadmaps or technical supplier specifications that resulted in measurable improvements in cost, quality, or tool throughput.
- Operational Results: Examples of leading cross-functional projects (partnering with Automation, Yield, or Quality teams) that resulted in documented gains in yield, reduction in defect rates, or optimization of line throughput.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $155,520.00-298,440.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

How we rate this

Semiconductor Packaging Process Engineering Lead at Intel rates 36 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.

Classification

Little AI. AI is not part of the work.

●●●● Builds AI80 to 100
●●●○ Works on AI60 to 79
●●○○ Uses AI40 to 59
●○○○ Little AI0 to 39

Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.