Silicon Photonics Packaging Product Engineer

Meet the Team

Optics Operations Product Engineering team partners with cross-functional team of development engineers to design and sustain Optical transceiver components and modules throughout their product lifecycle. Product Engineers are self-motivated, result oriented, and strong-minded engineers who embrace creativity and new ways of thinking to deliver innovative solutions.

Your Impact

Optics Operations is an organization that enables and accelerates innovation to create an unrivaled customer experience & competitive advantage for Cisco through end-to-end operation leadership and product lifecycle management. In this role, you will be a key Optics Operations Engineering team member supporting the Cisco Optics Operations next generation product portfolio.

Role & Responsibilities:

• Responsible for taking Silicon Photonics wafer & chip level packaging and assembly product from NPI to HVM release with OSAT partner.
• Work in collaboration with Engineering and Technology & Quality teams to set SYL/SBL & other statistical methods to characterize and optimize qualified optical packaging assembly processes, make decisions on innovative changes to improve yields and product quality
• Work in collaboration with Technology & Quality team to support new OSAT supplier engagement and introduction of new optical packaging product technology
• Drive the characterization of NPI product performances and yield including benchmark correlation to meet and/or exceed product cost targets
• Work in collaboration with Engineering and Technology & Quality teams to drive DFx for optical packaging design and assembly.
• Responsible for reviewing and monitoring ETest/WAT data to proactively drive resolution to critical yield issues
• Work in collaboration with Design team & Test Engineering to stabilize and improve product screening at wafer-probe and package levels.

Minimum Qualifications:

• MS minimum/PhD preferred degree in Electrical Engineering, physics or material science or equivalent educational background
• 5+ years of hands-on experience in chip on wafer (CoW) and CoC (Chip on Chip) wafer processing and assembly processes resulting in quantifiable improvements in quality, yield, & cost.
• Proven track record of transitioning products from NPI to High volume production at OSAT suppliers
• Strong knowledge of various wafer processing and flip chip assembly equipment
• Experience with design for manufacturability (DFM) during early product development.
• Strong Analytical skills & experience with troubleshooting and JMP scripting, Python, or AI models for automated yield prediction and monitoring
• Strong written, verbal, and interpersonal skills with experience presenting to senior level leadership.

Desired Skills:

• Solid understanding of manufacturing process, related to semiconductor assembly and optical module manufacturing
• Experience with Cu micro bump processing and flip chip assemblies and TSV technologies
• Knowledge of post CMOS back end assembly and packaging process technologies

At Cisco, we’re revolutionizing how data and infrastructure connect and protect organizations in the AI era – and beyond. We’ve been innovating fearlessly for 40 years to create solutions that power how humans and technology work together across the physical and digital worlds. These solutions provide customers with unparalleled security, visibility, and insights across the entire digital footprint.

Fueled by the depth and breadth of our technology, we experiment and create meaningful solutions. Add to that our worldwide network of doers and experts, and you’ll see that the opportunities to grow and build are limitless. We work as a team, collaborating with empathy to make really big things happen on a global scale. Because our solutions are everywhere, our impact is everywhere.

We are Cisco, and our power starts with you.