Wafer Sort & C4 Bump Module Equipment Technician
Intel is hiring a Wafer Sort & C4 Bump Module Equipment Technician. Level rates it ; you can apply on Intel.
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- Little AI ●○○○ is how Level rates this role: aI is not part of the work.
- Level lists 790 other open roles at Intel.
- The role was posted in the last few days.
AI in this role
Job Description:
- Performs electrical, mechanical, electronic, and/or mechatronic troubleshooting to identify and resolve problems with wafer-level semiconductor manufacturing equipment.
- Performs equipment setup, calibration, preventive maintenance, repair, adjustment, component replacement, and equipment recovery in accordance with approved procedures, specifications, equipment manuals, drawings, and safety requirements.
- Monitors and analyzes equipment performance and manufacturing data to identify abnormalities, equipment degradation, and conditions that may affect equipment availability, process stability, manufacturing output, or product quality.
- Responds to equipment alarms, equipment-related excursions, and manufacturing interruptions according to established procedures.
- Collects relevant equipment data, performs authorized troubleshooting, and works with Module Engineering to restore equipment to the required operating condition.
- Performs routine equipment health monitoring and supports early identification of equipment conditions or trends that could impact manufacturing performance and reliability.
- Works with Module Engineering to execute approved experiments, equipment configuration changes, equipment characterization, data collection, and continuous improvement activities.
- Supports Module Engineering with equipment troubleshooting through data analysis and controlled experimentation to maintain or improve equipment availability, reliability, performance, and manufacturing readiness.
- Supports established Statistical Process Control (SPC), equipment monitoring, and manufacturing control systems by responding to equipment-related abnormalities according to defined procedures and escalation requirements.
- Coordinates with OEMs and equipment suppliers for technical support, servicing, troubleshooting, repair, component replacement, and equipment recovery when required.
- Works closely with Module Engineering, Process Engineering, Manufacturing, Facilities, and other support teams to resolve equipment-related manufacturing issues.
- Creates and maintains equipment failure reports, maintenance records, troubleshooting documentation, calibration records, and other technical records supporting equipment performance and reliability.
- During factory startup and ramp, supports equipment installation, setup, conversion, qualification, and manufacturing readiness activities in accordance with approved designs and procedures.
- Performs assigned work in accordance with applicable EHS, cleanroom, quality, contamination-control, and manufacturing work-control requirements.
Qualifications:
Education
- Diploma in Mechanical Engineering, Mechatronics, Electronics, Electrical Engineering, Manufacturing Engineering, or a related technical field.
Experience
- Fresh graduates are encouraged to apply.
- Relevant technical experience in semiconductor manufacturing, equipment maintenance, equipment troubleshooting, or other high-volume manufacturing environments is an advantage.
Preferred Qualifications
- Hands-on experience with semiconductor manufacturing equipment troubleshooting, preventive maintenance, repair, setup, calibration, and equipment recovery.
- Familiarity with wafer-level semiconductor manufacturing processes and equipment in a high-volume manufacturing environment.
- Familiarity with equipment and process monitoring concepts such as Statistical Process Control (SPC), equipment performance monitoring, excursion response, and basic data analysis.
- Experience interpreting equipment alarms, diagnostic information, technical documentation, schematics, drawings, specifications, maintenance procedures, and equipment manuals.
- Familiarity with systematic equipment troubleshooting, failure analysis, and root-cause problem solving.
- Experience supporting equipment installation, conversion, qualification, manufacturing ramp, or equipment readiness activities is an added advantage.
- Familiarity with automated material handling, wafer handling, test and process equipment, metrology, automation, and manufacturing systems is an added advantage.
Other Requirements
- Strong technical aptitude and systematic problem-solving skills.
- Ability to work with precision instruments, diagnostic tools, and semiconductor manufacturing equipment.
- Basic understanding of mechanical, electrical, electronic, automation, and/or mechatronic systems.
- Basic understanding of wafer-level manufacturing operations and the relationship between equipment condition, process stability, manufacturing performance, and product quality.
- Ability to interpret and follow technical documentation, equipment manuals, schematics, specifications, maintenance procedures, and work instructions.
- Ability to identify abnormal equipment or manufacturing conditions and escalate according to established procedures.
- Good communication and teamwork abilities, including the ability to work effectively with Engineering, Manufacturing, Facilities, OEMs, and equipment suppliers.
- Willingness to learn and adapt to new semiconductor equipment, manufacturing processes, automation, and technologies.
- Attention to detail and commitment to safety, quality, equipment reliability, and manufacturing standards.
- Comfortable working in a semiconductor cleanroom and high-volume manufacturing environment.
- This role requires regular onsite presence to fulfill essential job responsibilities.
- Willing and able to work shift schedules, including rotating day and night shifts, where required.
- Able to support overtime, weekends, public holidays, factory ramp, and equipment recovery activities based on manufacturing requirements.
Job Type:
Shift:
Shift 9 A1 (Malaysia)Primary Location:
Malaysia, PenangAdditional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/A*Job posting details (such as work model, location or time type) are subject to change.
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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.How we rate this
Wafer Sort & C4 Bump Module Equipment Technician at Intel rates 36 out of 100 for how much of the daily work is AI. That makes it Little AI (AI Level 1 of 4). The level is about AI in the job, not seniority.
Little AI. AI is not part of the work.
- ●●●● Builds AI80 to 100
- ●●●○ Works on AI60 to 79
- ●●○○ Uses AI40 to 59
- ●○○○ Little AI0 to 39
Levels come from how often the tools, models and workflows of the role are named in the posting itself. Read the description and count the AI tools, models and workflows it names.
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